Material: CW024A

Information about the selected material


Property Value
Material-Labeling Cu-DHP (once SF-Cu)
Material-No. CW024A (once 2.0090)
Density (kg/dm³) 8,94
Temperature 20°C
Modulus of elasticity 132 kN / mm²
State cold formed
Cold forming very good
Temperature annealing 250 to 500°C
Temperature stress relief annealing 150 to 200°C
Welding very good
Soldering very good
Polishing (mechanically) good
Polishing (electrolytic/chemical) very good
Galvanizability very good
Suitability for dip tinning good

Corrosion resistance

Cu-DHP has good resistance in natural atmosphere (also sea air) and industrial atmosphere. Its surface becomes covered initially with dark, later with green adherent protective layers (patina), which are harmless. Even against drinking and industrial water (max. Flow rate 1.5 to 2 m/s ), and aqueous alkaline solutions, pure water vapor, non-oxidizing acids (no dissolved oxygen) and neutral salt solutions it is highly resistant. When annealing in a hydrogen atmosphere no material damage occurs. However, against solutions containing cyanides, halides and ammonia, to oxidizing acids, moist ammonia and halogen-containing gases, hydrogen sulfide and sea water, especially at high flow rates, it is not resistant.