Material: CW024A
Information about the selected material
Properties:
| Property | Value |
|---|---|
| Material-Labeling | Cu-DHP (once SF-Cu) |
| Material-No. | CW024A (once 2.0090) |
| Density (kg/dm³) | 8,94 |
| Temperature | 20°C |
| Modulus of elasticity | 132 kN / mm² |
| State | cold formed |
| Cold forming | very good |
| Temperature annealing | 250 to 500°C |
| Temperature stress relief annealing | 150 to 200°C |
| Welding | very good |
| Soldering | very good |
| Polishing (mechanically) | good |
| Polishing (electrolytic/chemical) | very good |
| Galvanizability | very good |
| Suitability for dip tinning | good |
Corrosion resistance
Cu-DHP has good resistance in natural atmosphere (also sea air) and industrial atmosphere. Its surface becomes covered initially with dark, later with green adherent protective layers (patina), which are harmless. Even against drinking and industrial water (max. Flow rate 1.5 to 2 m/s ), and aqueous alkaline solutions, pure water vapor, non-oxidizing acids (no dissolved oxygen) and neutral salt solutions it is highly resistant. When annealing in a hydrogen atmosphere no material damage occurs. However, against solutions containing cyanides, halides and ammonia, to oxidizing acids, moist ammonia and halogen-containing gases, hydrogen sulfide and sea water, especially at high flow rates, it is not resistant.